YEV09T20-0G【PDF 1/12 页】CONVERT DC/DC VERT POL 5.1V OUT

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YEV09T20 20A DC-DC POL Converter

4.5V to 13.8V Input ? 0.59V to 5.1V Output

Data Sheet

Member of the

Features

Family

RoHS lead free and lead-solder-exempt products are

available

High efficiency synchronous buck topology

Low noise fixed frequency operation

Wide input voltage range: 4.5V–13.8V

High continuous output current: 20A

Programmable output voltage range: 0.59V–5.1V

Overcurrent, and output overvoltage protections with

automatic restart

Remote differential output voltage sense

Power Good signal

Enable input

Start up into prebiased load

Applications

? Low voltage, high density systems with

Intermediate Bus Architectures (IBA)

? Point-of-load regulators for high performance

DSP, FPGA, ASIC, and microprocessors

No minimum load requirements

High MTBF of 64 million hours

Industry standard size through-hole single-in-line

package and pinout

? 1.45”x0.34” (36.8mm x 8.6mm)

Desktops, servers, and portable computing

Broadband, networking, optical, and

Low height of 0.61” (15.5mm)

Wide operating temperature range: 0 to 70oC

communications systems

Benefits

One part that covers many applications

Reduces board space, system cost and

UL94 V-0 flammability rating

UL60950, CSA C22.2 No. 60950-00, and TUV

EN60950-1:2001

complexity, and time to market

Description

Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate

Bus Architecture (IBA). The YEV09T20-0 non-isolated DC-DC point of load (POL) converter delivers up to 20A of

output current in an industry-standard single-in-line (SIP) through-hole package. The YEV09T20-0 POL converter

is an ideal choice for Intermediate Bus Architectures where point of load conversion is a requirement.

Operating from a 4.5-13.8V input the POL converter provides an extremely tightly regulated programmable output

voltage of 0.59V to 5.1V. The POL converter offers exceptional thermal performance, even in high temperature

environments with minimal airflow. This performance is accomplished through the use of advanced circuit

solutions, packaging and processing techniques. The resulting design possesses ultra-high efficiency, excellent

thermal management, and a slim body profile that minimizes impedance to system airflow, thus enhancing cooling

for both upstream and downstream devices. The use of automation for assembly, coupled with advanced power

electronics and thermal design, results in a product with extremely high reliability.

ZD-02093 Rev. 1.2, 18-Jun-10

www.power-one.com

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